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Master's Dissertation
DOI
10.11606/D.3.2008.tde-25092008-140736
Document
Author
Full name
Fernando Trevisan Saez Parra
Institute/School/College
Knowledge Area
Date of Defense
Published
São Paulo, 2008
Supervisor
Committee
Santos Filho, Sebastião Gomes dos (President)
Lucchi, Júlio César
Onmori, Roberto Koji
Title in Portuguese
Fabricação e caracterização de termopares Cu/CuNixPy obtidos por deposição eletroquímica.
Keywords in Portuguese
Eletrodeposição
Filmes finos
Sensor
Abstract in Portuguese
Neste trabalho foram estudadas deposições químicas de ligas CuNixPy e foram fabricados termopares Cu/CuNixPy sobre superfícies de lâminas de silício. Inicialmente, as superfícies foram pré-ativadas em uma solução diluída de ácido fluorídrico contendo PdCl2. Em seguida, foi empregado um banho químico alcalino diluído em água deionizada contendo 15 g/l NiSO4.6H2O; 0,1 a 0,3 g/l CuSO4.5H2O; 15 g/l Na2HPO2.H2O e 60 g/l Na3C6H5O7.2H2O na temperatura de 80OC sendo que NH4OH foi adicionado até que o pH do banho atingisse o valor de 8,0. Verificamos que a concentração do sal de cobre na solução de deposição afeta substancialmente a quantidade de cobre nos depósitos de CuNixPy. As concentrações planares e as composições dos filmes depositados foram obtidas através da técnica de espectrometria de retroespalhamento de Rutherford (RBS) e a morfologia superficial foi caracterizada através da técnica de microscopia de força atômica (AFM). A solução: 15 g/l NiSO4.6H2O + 0,3 g/l CuSO4.5H2O + 15 g/l Na2HPO2.H2O + 60 g/l Na3C6H5O7.2H2O + NH4OH (pH 8.0) na temperatura de 80OC foi a escolhida na obtenção da liga CuNiP0,5 para a construção de termopares Cu/CuNiP0,5 os quais apresentaram potência termoelétrica de aproximadamente (866) V/oC semelhante aos valores típicos apresentados na literatura para Cu/CuNi.
Title in English
Fabrication and characterization of Cu/CuNixPy thermocouples obtained by electroless deposition.
Keywords in English
Electroless deposition
Thermocouple
Thermoelectric power
Abstract in English
In this work, it was studied chemical depositions of CuNixPy alloys and it was fabricated Cu/CuNixPy thermocouples onto silicon wafer surfaces. Initially, surfaces were pre-activated in a diluted hydrofluoric acid solution containing PdCl2. Following, it was used a de-ionizedwater- diluted alkaline chemical bath containing 15 g/l NiSO4.6H2O; 0,1-0,3 g/l CuSO4.5H2O; 15 g/l Na2HPO2.H2O and 60 g/l Na3C6H5O7.2H2O at temperature of 80OC where NH4OH was added until ph was 8.0. The concentration of copper salt in the deposition solution greatly affected the Cu content of the CuNixPy deposits. Areal concentration and composition were measured by Rutherford Backscattering Spectrometry (RBS) and surface morphology was characterized by Atomic Force Microscopy (AFM). The solution: 15 g/l NiSO4.6H2O; 0.3 g/l CuSO4.5H2O; 15 g/l Na2HPO2.H2O; 60 g/l Na3C6H5O7.2H2O; NH4OH (pH 8.0) at the temperature of 80OC was chosen to obtain the CuNiP0.5 alloy to fabricate Cu/CuNiP0.5 thermocouples with thermoelectric power of about (866) V/oC, which is similar to the typical values reported in literature for Cu/CuNi.
 
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Publishing Date
2008-10-07
 
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