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Doctoral Thesis
DOI
https://doi.org/10.11606/T.43.2001.tde-03062002-122853
Document
Author
Full name
Rogério Junqueira Prado
E-mail
Institute/School/College
Knowledge Area
Date of Defense
Published
São Paulo, 2001
Supervisor
Committee
Fantini, Marcia Carvalho de Abreu (President)
Camargo Junior, Sergio Alvaro de Souza
Silva, Antonio Jose Roque da
Tolentino, Hélio Cesar Nogueira
Torriani, Iris Concepción Linares de
Title in Portuguese
Análise das propriedades químicas, morfológicas e estruturais de filmes finos de a-Si1-xCx:H depositados por PECVD.
Keywords in Portuguese
a-Si1-xCx:H
carbeto de silicio amorfo hidrogenado
EXAFS
ligas amorfas
PECVD
Abstract in Portuguese
Nesta tese discorremos sobre crescimento e caracterização de filmes finos de carbeto de silício amorfo hidrogenado (a-Si1-xCx:H) crescidos por deposição química de vapor assistida por plasma (PECVD). Os filmes foram depositados a partir de misturas de silano, metano e hidrogênio, no regime de plasma faminto por silano. Amostras depositadas nessas condições possuem uma maior concentração de ligações Si-C, ou seja, melhor coordenação entre átomos de Si e C, com menor quantidade de ligações C-Hn e Si-H, apresentando um conteúdo de hidrogênio da ordem de 20 at.%, e baixa densidade de poros. Foram analisadas e correlacionadas diversas propriedades dos filmes depositados, explorando-se a potência de rf e a diluição da mistura gasosa em hidrogênio, de forma a melhorar a ordem química, estrutural e morfológica na fase sólida. A composição dos filmes foi determinada por retroespalhamento de Rutherford e espectrometria de recuo frontal. Enfatizou-se a análise dos diferentes tipos de ligações químicas existentes no material por espectrometria no infravermelho por transformada de Fourier, o estudo das propriedades estruturais por espectroscopia de absorção de raios X na borda K do silício, e das propriedades morfológicas analisando-se os perfis de espalhamento de raios X a baixo ângulo para diferentes ligas depositadas. Foram também realizadas medidas de dureza e de microscopia eletrônica para uma amostra estequiométrica, de forma a complementar os demais dados obtidos. Filmes estequiométricos depositados nessas condições apresentam entre 80 e 90% do total de suas ligações entre átomos de Si e C e dureza Vickers de 33 GPa. Tratamentos térmicos entre 600 ºC e 1000 ºC, realizados em atmosfera inerte de N2, mostraram que filmes stequiométricos são mais estáveis frente à absorção de oxigênio.
Title in English
Analysis of the chemical, morphological and structural properties of a-Si1-xCx:H thin films deposited by PECVD.
Keywords in English
amorphous hydrogenated silicon carbide
Abstract in English
In this work we discuss the growth and characterization of amorphous hydrogenated silicon carbide thin films (a-Si1-xCx:H) deposited by plasma enhanced chemical vapor deposition (PECVD). It was used a gaseous mixture of silane, methane and hydrogen, at the silane starving plasma regime. Samples grown at these conditions and with a very low silane flow have a larger concentration of Si-C bonds, that is, better coordination among Si and C atoms, with smaller amount of C-Hn and Si-H bonds, presenting a hydrogen content of about 20 at.%, and low density of pores. Material’s properties were correlated for the deposited films, exploring the rf power and hydrogen dilution of the gaseous mixture, aiming to improve the chemical, structural and morphological order in the solid phase. The composition of the films was determined by Rutherford backscattering and forward recoil spectrometry. The Fourier transform infrared spectrometry analysis studied the chemical bonding inside the material, X-ray absorption spectroscopy at the silicon K edge the structural properties in samples as-grown and after thermal annealing, and small angle X-ray scattering was used for the morphological characterization. The hardness was measured and transmission electron microscopy micrographs were taken for a stoichiometric sample, in order to complement the obtained data. Stoichiometric films presented a very high chemical order, having between 80 and 90% of their bonds formed by Si and C atoms and Vickers hardness of 33 GPa. Annealing processes between 600 ºC and 1000 ºC, performed in an inert N2 atmosphere, showed that stoichiometric films are more stable against oxygen absorption.
 
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Publishing Date
2002-06-18
 
WARNING: The material described below relates to works resulting from this thesis or dissertation. The contents of these works are the author's responsibility.
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